Service Level: I
The base service process is the process that the service team installs in local site. The physical processes require to be negotiated locally with each customer. This support shall include manpower of a sufficient skill capable of debugging cards that fail at both incoming inspection and manufacturing fallout along with the associated equipment required to complete this task. A completed failure analysis will include MSI manufacturing contributable defects (i.e., box induced failures), no-defects-found (NDF), as well as customer, suppliers's contributable defects.
These minimum functions to include, but not limited to:
1st pass failure analysis and reporting of failing commodities based on the service representative'ss technical experience and training.
Segregation and reporting of all customer or suppliers's fails at the MSI service team Data to be made available to MSI service team and local sale office on a weekly basis Service team should assist the customer on RMA Requests and Supplier interface to MSI Screening of incoming material.

Service Level: II
In addition to the duties carried out in level I process, the service team personnel shall test products using processes that have been agreed with MSI service engineering. This may either be the approved service validation procedure or suppliers functional test if available. The agreed tests may require the purchase of hardware for either establishing the test set up or for test consumable, this hardware requires to be procured by the service engineering team support.
The additional functions of the level II will be, but not limited to:
Testing of all cards that do not exhibit mechanical damage, pass the agreed test process, require to be re-labeled as NDF and returned to customer for store as buffer.
In the event of high percentages of NDF cards being found, the service team should check with customer and Engineering team to determine the course of action required to reduce the occurrence of this fault.

Service Level: III
This is the first level repair process and includes the removal and replacement of components up to parts/commodity level, it does not require the use of solder fountains or other such specialized equipment. The degree of repair and the equipment necessary for the level of repair shall be agreed between the service team and local office requirement.
The additional functions of the level III will be, but not limited to Repair and replacement of components and connectors up to parts/commodity level workmanship shall be in accordance with the relevant product specifications and all operators engaged in such work should be qualified to the relevant service standard.
All products after repair, shall be tested using the service engineering agreed test process

Service Level: IV
This is the second level repair process and includes the removal and replacement of components up to and including PLCC and larger connectors. , it will require the use of specialized equipment such as Solder Fountains, Hot Air tools for the removal of PLCcs etc.. The degree of repair and the equipment necessary for the that level of repair shall be agreed between the local sale office and service team.
The additional functions of the level will be, but not limited to:
Repair and replacement of components and connectors up to PLCC level, workmanship shall be in accordance with the relevant cards specifications and all operators engaged in such work should be qualified to the relevant supplier standard.
All cards after repair, shall be tested using the service engineering agreed test process

Service Level: V
This is the final level repair process and includes the removal and replacement of components up to and including BGA, press fit etc.. , it will require the use of specialized equipment such as Solder Fountains, Hot Air tools , ovens etc. for the removal and replacement of BGAs. The degree of repair and the equipment necessary for the that level of repair shall be agreed between the local sale office and the service team.
The additional functions of the level will be, but not limited to:
Repair and replacement of components and connectors up to and including BGA level, workmanship shall be in accordance with the relevant IPC specifications and all operators engaged in such work should be qualified to the relevant SOP standard.
All cards after repair, shall be tested using the service engineering agreed test process.